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SMIC, Shougang to build Beijing chip plant

2002/08/01

Shanghai-based Semiconductor Manufacturing International Corp (SMIC) will build Beijing Semiconductor Manufacturing Corporation (BSMC) in the Chinese capital next month in co-operation with steel giant Shougang Group, a Beijing municipal government source said.

The project includes an 8-inch, 0.18-micron wafer fabrication facility (fab) and a 12-inch, 0.10-micron wafer fab - the first 12-inch wafer fab on the agenda in the Chinese mainland - in the Beijing Technological and Economic Development Area with a proposed investment of US$1.3 billion.

Richard Chang, SMIC president and chief executive officer said construction would start at the end of this year. "We are considering the project mainly to meet market demand because the fierce competition forces us to cut costs and run on a large scale," Sarina Huang, an SMIC spokeswoman, said.



 
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