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SMIC, Shougang to build Beijing chip plant
2002/08/01
Shanghai-based Semiconductor Manufacturing International
Corp (SMIC) will build Beijing Semiconductor Manufacturing
Corporation (BSMC) in the Chinese capital next month in
co-operation with steel giant Shougang Group, a Beijing
municipal government source said.
The project includes an 8-inch, 0.18-micron wafer
fabrication facility (fab) and a 12-inch, 0.10-micron wafer fab
- the first 12-inch wafer fab on the agenda in the Chinese
mainland - in the Beijing Technological and Economic
Development Area with a proposed investment of US$1.3
billion.
Richard Chang, SMIC president and chief executive officer
said construction would start at the end of this year. "We are
considering the project mainly to meet market demand because
the fierce competition forces us to cut costs and run on a
large scale," Sarina Huang, an SMIC spokeswoman, said.